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Preparation and etching processing of planar thin film of Pr~(3+)-doped fluorozirconate glass

机译:掺Pr〜(3+)氟锆酸玻璃平板薄膜的制备与刻蚀工艺

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摘要

Planar thin-films of a 60ZrF_(4)·35BaF_(2)·5PrF_(3) composition were successfully prepared from Zr(hfa)_(4), Ba(hfa)_(2)(tg), Pr(fod)_(3) and NF_(3) by an electron cyclotron resonance plasma-enhanced chemical vapor deposition technique. The films obtained were colorless and amorphous. As etching processing of the prepared thin-film, dry etching was performed using Ar, CF_(4), SF_(6), Cl_(2) and Cl_(2)-BCl_(3) gases. The Ar etching in which no reactive ion-etching is anticipated exhibited the fastest etching rate. Wet etching was also performed using a ZrOCl_(2)-HCl etching solution. The etching rate was extremely fast compared with those of dry etching. In this etching, however, undesirable side-etching occurred. At the present stage, therefore, the most preferable etching processing is dry etching by an Ar gas.
机译:由Zr(hfa)_(4),Ba(hfa)_(2)(tg),Pr(fod)成功制备了60ZrF_(4)·35BaF_(2)·5PrF_(3)组成的平面薄膜_(3)和NF_(3)通过电子回旋共振等离子体增强化学气相沉积技术完成。得到的膜是无色和无定形的。作为制得的薄膜的蚀刻处理,使用Ar,CF_(4),SF_(6),Cl_(2)和Cl_(2)-BCl_(3)气体进行干法蚀刻。预期没有反应性离子蚀刻的Ar蚀刻表现出最快的蚀刻速率。还使用ZrOCl_(2)-HCl蚀刻溶液进行湿法蚀刻。与干蚀刻相比,蚀刻速度非常快。然而,在该蚀刻中,发生了不希望的侧面蚀刻。因此,在目前阶段,最优选的蚀刻工艺是利用氩气的干法蚀刻。

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