Finite element modeling and simulation for bending analysis of multi-layer printed circuit boards using woven fiber composite

摘要

As the electronic products are desired to have many functions with low weight and small size increasingly, the ultra-thin and multi-layer printed circuit boards (PCBs) are required to be used extensively in electronic packaging assemblies. Usually, these multi-layer PCBs consist of multiple layers of woven glass fiber reinforced epoxy resin composite substrate sandwiched between copper foils. The mechanical properties of these multi-layer PCBs can be represented basically by their bending stiffness. However, complex woven composite material properties complicate the bending stiffness analysis. In this research, a finite element analysis model was suggested to describe the bending behavior of woven fiber composite multi-layer PCB. Both finite element simulation and experiment were employed in this study. Since the small discrepancy between the numerical simulation and experimental results was obtained, the availability of this finite element model was confirmed by comparison with each other. And also the effects of woven fiber composite material properties of the multi-layer PCB on the bending phenomenon were investigated.