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首页> 外文期刊>Journal of manufacturing science and engineering: Transactions of the ASME >Residual stresses and workpiece deformation due to polishing and plating of computer hard disk substrates
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Residual stresses and workpiece deformation due to polishing and plating of computer hard disk substrates

机译:由于计算机硬盘基板的抛光和镀覆而产生的残余应力和工件变形

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摘要

Residual stress distributions due to plating and polishing were determined for nickel-phosphorus plated aluminum alloy disks. Knowledge of these stresses provides insight into the material deformation and removal processes, information as to theeffects of processing conditions on residual stress magnitude and can also serve as a basis for development of models of material deformation and removal in polishing. Measured disk shape data was fitted to an analytical solution for plate displacementdue to bending moments, and residual stresses were calculated. Plating and polishing residual stresses were separated. Polishing residual stress is compressive indicating differential plastic deformation between the surface and interior regions of theworkpiece. Residual stresses produced in polishing operations in which process motions were constrained so that polishing was unidirectional were measured. The results show large differences between amounts of deformation in the polishing direction andthe direction perpendicular to it.
机译:对于镀镍-磷的铝合金圆盘,确定了由于镀层和抛光引起的残余应力分布。这些应力的知识提供了对材料变形和去除过程的洞察力,有关加工条件对残余应力大小的影响的信息,并且还可以作为开发抛光中材料变形和去除模型的基础。将测量的圆盘形状数据拟合到由于弯矩而引起的板位移的分析解决方案中,并计算残余应力。电镀和抛光残余应力是分开的。抛光残余应力是压缩性的,表明工件的表面和内部区域之间存在差异的塑性变形。测量了在抛光过程中产生的残余应力,这些应力会限制工艺运动,从而使抛光是单向的。结果表明,在抛光方向和垂直于抛光方向的方向上的变形量之间存在很大差异。

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