首页> 外文期刊>Journal of Korean Institute of Metal and Materials >The Effect of Various Electrolyte Concentrations on Surface and Electrical Characteristic of the Copper Deposition Layer at Anodizing of Titanium Anode
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The Effect of Various Electrolyte Concentrations on Surface and Electrical Characteristic of the Copper Deposition Layer at Anodizing of Titanium Anode

机译:钛阳极氧化时各种电解质浓度对铜沉积层表面和电学特性的影响

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摘要

Recently, the requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. Therefore, it is important to examine the surface state of substrate depending on the processing parameter during the anodic oxidation. This study investigated the effect of the various electrolyte concentrations on anodizing of titanium anode prior to copper electrodeposition. Different surface morphology of anodized titanium was obtained at different electrolytic concentration 0.5 M to 3.0 M. In addition, the effect that the surfaces and the electrical characteristics on the electrodeposited copper layer was observed. In this study, surface anodized in the group containing 0.5 M H_2SO_4 shows more uniform copper crystals with low surface roughness. the surface roughness and sheet resistance for 0.5 M H_2SO_4 group were 1.353 mu m and 0.104 m OMEGA /sq, respectively.
机译:近来,随着电子元件的小型化和小型化,对超薄铜箔的需求增加。因此,重要的是根据阳极氧化期间的处理参数来检查基板的表面状态。这项研究调查了各种电解质浓度对铜电沉积前阳极钛阳极氧化的影响。在0.5 M至3.0 M的不同电解浓度下获得了不同的阳极氧化钛表面形态。此外,还观察到电沉积铜层的表面和电学特性的影响。在这项研究中,在包含0.5 M H_2SO_4的组中进行阳极氧化的表面显示出更均匀的铜晶体,且表面粗糙度较低。 0.5 M H_2SO_4组的表面粗糙度和薄层电阻分别为OMEGA / sq为1.353μm和0.104 m。

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