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Interdiffusion in Co/Ta multilayer thin films

机译:Co / Ta多层薄膜中的互扩散

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摘要

We will discuss the stress release phenomena, structural relaxation and interdiffusion processes during annealing. The [Co(4nm)/Ta(4nm)]_(38) multilayers were prepared by dc magnetron sputtering on Si substrate. The multilayers were annealed at various temperatures (523 - 673K) in vacuum (under 10"5 torr) furnace. The effective interdiffusion coefficients were determined from the slope of the best straight line fit of the first peak intensity versus annealing time [d ln(I(t)/I(o)) /dt] by X-ray diffraction (XRD) low angle measurements. The drastic decrease of the relative intensity in the initial stage shown due to the structural relaxation was excluded in the calculation of effective interdiffusion coefficients. The temperature dependence of interdiffusion in the range of 523 - 673K is described by D = 3.2 * 10~(-19) exp(-0.51±0.11 eV/kT) mV.
机译:我们将讨论退火过程中的应力释放现象,结构松弛和相互扩散过程。 [Co(4nm)/ Ta(4nm)] _(38)多层通过直流磁控溅射在Si衬底上制备。在真空(10“ 5 torr以下)炉中于不同温度(523-673K)下对多层进行退火。有效的互扩散系数由第一峰强度与退火时间[d ln( I(t)/ I(o))/ dt]通过X射线衍射(XRD)低角度测量得到,初始相互相对强度的急剧下降是由于结构弛豫所引起的,因此不包括在有效互扩散计算中D = 3.2 * 10〜(-19)exp(-0.51±0.11 eV / kT)mV描述互扩散的温度依赖性在523-673K范围内。

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