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首页> 外文期刊>Journal of engineering physics and thermophysics >INFLUENCE OF A FLUX OF HIGH-VELOCITY MICROPARTICLES ON THE PARAMETERS OF INTEGRATED CIRCUITS PLACED BEHIND A THICK-WALLED OBSTACLE
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INFLUENCE OF A FLUX OF HIGH-VELOCITY MICROPARTICLES ON THE PARAMETERS OF INTEGRATED CIRCUITS PLACED BEHIND A THICK-WALLED OBSTACLE

机译:高速微粒的通量对放置在厚壁障碍物后面的集成电路参数的影响

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摘要

Experimental data showing that on collision of a flux of high-velocity microparticles (which is close to the fluxes of space particles in parameters) with a thick-walled metal obstacle we have failure of integrated circuits placed behind this obstacle have been given.
机译:实验数据表明,在高速微粒通量(与参数中的空间粒子通量接近)与厚壁金属障碍物碰撞时,我们发现了在该障碍物后面放置集成电路的故障。

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