Effect of Cooling Rate on Microstructure and Mechanical Properties of Eutectic Sn-Ag Solder Joints with and without Intentionally Incorporated Cu_6Sn_5 Reinforcements

摘要

Solidification of eutectic Sn-Ag solder, with and without Cu_6Sn_5 composite reinforcements, on copper substrates, was investigated at two different cooling rates. The size, orientatin, randomness, and overall morphology of the dendritic microstructure were examined as a function of cooling rate. Cu_6Sn_5 particle reinforcements were found to act as nucleation sites for dendrites, in addition to sites on the substrate/solder interface. The mechanical properties of these solders were also examined as a function of cooling rate. Solder joints with a lower load-carrying area were found to exhibit higher shear strength, but reduced ductility when compared to solder joints with more load carrying area.