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High-Performance MWIR/LWIR Dual-Band 640 X 480 HgCdTe/Si FPAs

机译:高性能MWIR / LWIR双频640 X 480 HgCdTe / Si FPA

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摘要

HgCdTe grown on large-area Si substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive CdZnTe substrates. The goal of this work is to evaluate the use of HgCdTe/Si for mid-wavelength/long-wavelength infrared (MWIR/LWIR) dual-band FPAs. A series of MWIR/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction (TLHJ) device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. The wafers showed low macro-defect density (< 300 cm~(-2)) and was processed into 20-(mu)m-unit-cell 640 X 480 detector arrays which were mated to dual-band readout integrated circuits (ROICs) to produce FPAs. The measured 80-K cutoff wavelengths were 5.5 (mu)m for MWIR and 9.4 (mu)m for LWIR, respectively. The FPAs exhibited high pixel operabilities in each band, with noise equivalent differential temperature (NEDT) operabilities of 99.98percent for the MWIR band and 99.6percent for the LWIR band demonstrated at 84 K.
机译:与较小,较昂贵的CdZnTe衬底相比,在大面积Si衬底上生长的HgCdTe允许使用更大的阵列格式,并可能降低焦平面阵列(FPA)的成本。这项工作的目的是评估HgCdTe / Si在中波长/长波长红外(MWIR / LWIR)双波段FPA中的使用。通过分子束外延(MBE)在100 mm(211)Si衬底上生长一系列MWIR / LWIR双带HgCdTe三层n-P-n异质结(TLHJ)器件结构。晶圆显示出低的宏观缺陷密度(<300 cm〜(-2)),并被加工成20-μm单位单元的640 X 480检测器阵列,该检测器阵列与双波段读出集成电路(ROIC)匹配制作FPA。测得的80-K截止波长对于MWIR为5.5μm,对于LWIR为9.4μm。 FPA在每个频段上均表现出较高的像素可操作性,在84 K时,MWIR频段的等效噪声温差(NEDT)操作率为99.98%,LWIR频段的等效噪声温差(NEDT)为99.6%。

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