Stress-Strain Curves of flip-Chip solder Balls based on finite-Element modeling of Thermal Displacements Measured by Electronic Speckle pattern Interferometry

摘要

Electronic speckle speckle pattern interferometry (ESPI)was applied to noncontat,real-time evaluation of thermal deformation in a flip-chip solder joints.To measure the deformation of such tiny components as the solder balls in the flip-chip,the spatial resolutino of ESPI was increased to submicron scale by magnifying the areas studied.Experimental-compoutational procedures were developed to obtain stress-strain curves for solder balls in the flip-chip based on finite-element modeling (FEM)of in-phane ESPI thermal displacement data.The stress-strain curve obtained for the flip-chip solder was compared with those for bulk solder.The microstructure was also studied to clarify the stress-strain curve results.