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首页> 外文期刊>Journal of Electronic Materials >Surface-tension Measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions
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Surface-tension Measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions

机译:添加铜的共晶合金(Ag-Sn 96.2 at。%)的表面张力测量

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The maximum bubble-pressure method has been used to measure the surface tension and density of liquid alloys (Ag-Sn)_(eut)+Cu(X_(Cu=0.005,0.020,0.0375,and 0.065 (mole fraction).The surface tension and density measurement were curried out in the temperature ranges of 262-942degC and 264-937degC,respectively.The liner dependenciesof surface tensions and densities on temperature were observed,and they were described by straight-line equations.It has been found that the additions of Cu to the Ag-Sn eutectic alloy increase the surface tension.Experimental data of the surface tension were compared with those from modeling based on Butler's method,using the optimized-thermodynamic parameters from the literature,and a slight tendency contrary to the experimental results was observed.
机译:最大气泡压力法已用于测量液态合金(Ag-Sn)_(eut)+ Cu(X_(Cu = 0.005,0.020,0.0375,和0.065(摩尔分数))的表面张力和密度。分别在262-942degC和264-937degC的温度范围内进行了张力和密度的测量。观察了表面张力和密度对温度的线性依赖性,并用直线方程式进行了描述。在Ag-Sn共晶合金中添加Cu会增加表面张力。将表面张力的实验数据与基于Butler方法建模的结果进行了比较,并使用了文献中的优化热力学参数,但与实验相反的趋势有些微观察结果。

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