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首页> 外文期刊>Journal of Electronic Materials >Influence of the Silicon Substrate on Defect Formation in MCT Grown on II-VI Buffered Si Using a Combined Molecular Beam Epitaxy/Metal Organic Vapor Phase Epitaxy Technique
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Influence of the Silicon Substrate on Defect Formation in MCT Grown on II-VI Buffered Si Using a Combined Molecular Beam Epitaxy/Metal Organic Vapor Phase Epitaxy Technique

机译:结合分子束外延/金属有机气相外延技术,硅衬底对II-VI缓冲S​​i上生长的MCT中缺陷形成的影响

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摘要

II-VI buffer layers grown by molecular beam epitaxy(MBE)onto silicon exhibit a uniform,slightly faceted surface morphology.However,a number of surface defects are apparent and these are amplified by the subsequent growth of mercury cadmium telluride(MCT)by metal organic vapor phase epitaxy.Some of these defects have been traced to polishing damage present within the silicon substrate.A range of analytical techniques,including x-ray topography,have been used to track the defects from the substrate through to the buffer layer and into the MCT.Defects of this type will cause dead elements in the infrared focal plane arrays and will be a major cause of low operabilities.
机译:通过分子束外延(MBE)在硅上生长的II-VI缓冲层具有均匀,微刻面的表面形态,但是,许多表面缺陷是明显的,并且随后金属中碲化镉镉(MCT)的生长会放大这些缺陷这些缺陷中的一些已被追溯到硅衬底内存在的抛光损伤。已使用了包括X射线形貌在内的一系列分析技术来跟踪从衬底到缓冲层再到缓冲层的缺陷。这种类型的缺陷将导致红外焦平面阵列中的死元素,并将成为可操作性低下的主要原因。

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