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首页> 外文期刊>Journal of Electronic Materials >Annealing and Measurement Temperature Dependence of W_(2)B- and W_(2)B_(5)-Based Rectifying Contacts to p-GaN
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Annealing and Measurement Temperature Dependence of W_(2)B- and W_(2)B_(5)-Based Rectifying Contacts to p-GaN

机译:基于W_(2)B和W_(2)B_(5)的整流接触对p-GaN的退火和测量温度依赖性

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摘要

Schottky contact formation on p-GaN using W_(2)B/Pt/Au and W_(2)B_(5)/Pt/Aumetallization schemes was investigated using x-ray photoelectron spectroscopy (XPS), current-voltage (I-V), and Auger electron spectroscopy measurements. The Schottky barrier height (SBH) determined from XPS is 2.71 eV and 2.87 eV for as-deposited W_(2)B- and W_(2)B_(5)-based contacts, respectively. By comparison, fitting of the I-V curves using the thermionic field emission model gives unphysical SBHs > 4 eV due to the presence of an interfacial layer acting as an additional barrier to carrier transport. Upon annealing to approx600-700 deg C, the diodes show slight deterioration in rectifying behavior due to the onset of metallurgical reactions with the GaN. The experimental dependence of the reverse leakage current on bias and measurement temperature is inconsistent with both thermionic emission and thermionic field emission models, suggesting that leakage must originate from other mechanisms such as surface leakage or generation in the depletion layer through deep-level defects.
机译:使用X射线光电子能谱(XPS),电流-电压(IV),使用W_(2)B / Pt / Au和W_(2)B_(5)/ Pt / Au金属化方案在p-GaN上形成肖特基接触和俄歇电子能谱测量。由XPS确定的肖特基势垒高度(SBH)对于基于沉积的基于W_(2)B和W_(2)B_(5)的触点分别为2.71 eV和2.87 eV。相比之下,使用热电子场发射模型对I-V曲线进行拟合可得出非物理的SBH> 4 eV,这是因为存在界面层,这是对载流子传输的附加障碍。退火至约600-700摄氏度时,由于与GaN发生冶金反应,二极管的整流性能略有下降。反向泄漏电流对偏置和测量温度的实验依赖性与热电子发射和热电子场发射模型均不一致,这表明泄漏必须源自其他机制,例如表面泄漏或耗尽层中由于深层缺陷而产生。

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