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首页> 外文期刊>Journal of Electronic Materials >Selective Dry Etching of (Sc_20_3)_x(Ga_20_3)_(1-x)Gate Dielectrics and Surface Passivation Films on GaN
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Selective Dry Etching of (Sc_20_3)_x(Ga_20_3)_(1-x)Gate Dielectrics and Surface Passivation Films on GaN

机译:(Sc_20_3)_x(Ga_20_3)_(1-x)门介电层和GaN上的表面钝化膜的选择性干蚀

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摘要

(Sc_2O_3)_x(Ga_2O_3)_(1-x)films grown by molecular beam epitaxy show promise for use as surface passivation layers and gate dielectrics on GaN-based high elec-tron mobility transistors.Completely selective,low-damage,dry etching of (Sc_2O_3)_x(Ga_2O_3)_(1-x)films with respect to GaN can be achieved with low-power inductively coupled plasmas of CH_4H-2/Ar with etch rates in the range 200-300 A/min.The incident ion energies are of order 100 eV,and no roughening of the underlying GaN was observed under these conditions.Similar etch rates were obtained with Cl_2/Ar discharges under the same conditions,but GaN showed rates almost an order of magnitude higher.
机译:通过分子束外延生长的(Sc_2O_3)_x(Ga_2O_3)_(1-x)薄膜有望在GaN基高电子迁移率晶体管上用作表面钝化层和栅极电介质。完全选择性,低损伤,干法蚀刻(Sc_2O_3)_x(Ga_2O_3)_(1-x)膜相对于GaN的数量可以通过CH_4H-2 / Ar的低功率电感耦合等离子体实现,蚀刻速率在200-300 A / min范围内。离子能量为100 eV量级,在这些条件下未观察到下层GaN的粗糙化。在相同条件下用Cl_2 / Ar放电获得了相似的蚀刻速率,但GaN的速率几乎高出一个数量级。

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