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Ion Beam Synthesis of Low Resistivity Contacts in Amorphous Silicon-Based Materials

机译:非晶硅基材料中低电阻率触点的离子束合成

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摘要

Low resistivity layers have been formed at low process temperatures, by hgih dose Co~+ ion implantation in to hydrogenated amorphous silicon (a-Si:H) and amorphous silicon carbide (a-SiC:H). The lowest resistivities, of the order of 10 ohms/Sq, has been observed frot he carobn-free films (a-Si:H) and can be obtained at annealing temperatures of <250 deg C. Schottky barrier contacts to the a-Si:H films exhibit near ideal behavior with low leakage currents, of the order 10~(-9) A.cm~(-2). The electrical properties of the amorphous films are assessed as a function of ion dose, dose rate and annealing conditions, with a view to optimizing these parameters.
机译:通过在高剂量的Co〜+离子注入过程中向氢化非晶硅(a-Si:H)和非晶碳化硅(a-SiC:H)中形成低电阻率层。在无卡宾薄膜(a-Si:H)上观察到的最低电阻率约为10 ohms / Sq,可以在<250摄氏度的退火温度下获得。肖特基势垒与a-Si接触:H薄膜在低泄漏电流(约10〜(-9)A.cm〜(-2))下表现出接近理想的性能。为了优化这些参数,根据离子剂量,剂量率和退火条件评估非晶膜的电性能。

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