Effect of Microalloying on the Creep Strength and Microstructure of an Eutectic Sn-Pb Solder Alloy

摘要

The present research aims to improve the creep strength of Sn-Pb eutectic solder by the addition of small amount of effective elements, such as Sb,Ag,Cu,a dn Ga, which are selected by preliminary experiments and analysis. Creep tests were conducted at the stress and temperature range of 5 N/m to 15 N/m m~2 and 313 K to 378 K, respectively. The microalloying treatment increased significantly the creep-rupture time by one order at the same condition of creep stress and temperature, comparing with that of the regular Sn-Pb eutectic solder alloy. Microstructural observation indicated that the excellent creep properties are obtained by the particles dispersion hardening due to the combined addition of the microalloying elements.