Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate

摘要

Replacing high-temperature leaded solders with lead-free alternatives is an important issue in the electronics industry. This study investigates the viability of lead-free Bi-Ag and Bi-Sb solder alloys, ranging in composition from 1.5 to 5 wt.% Ag and Sb. The effects of melting point, wetting angle, microstructure, and morphology were analysed by differential scanning calorimetry, optical microscopy, and scanning electron microscope-energy dispersive x-ray analysis. The results showed that all tested alloys had suitable melting temperatures, ranging from 271 to 276℃. The wetting angle increased by raising the Sb content, but, in contrast, by increasing the wt.% of Ag, the wetting angle decreased. A Cu-rich phase was present in all Bi-Ag alloys, The Cu-rich phase was also present in decreasing amounts with increasing Sb, but, with 5Sb, there was no Cu-rich phase, and a Cu3Sb intermetallic compound was present in the interface and as precipitates in the solder. Grooving along Cu grain boundaries was observed at the interface for the rest of the alloys.