首页> 外文期刊>Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry >INFLUENCE OF UNDERPOTENTIAL DEPOSITION OF COPPER WITH SUBMONOLAYER COVERAGE ON HYDROGEN ADSORPTION AT THE STEPPED SURFACES PT(955), PT(322) AND PT(544) IN SULFURIC ACID SOLUTION
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INFLUENCE OF UNDERPOTENTIAL DEPOSITION OF COPPER WITH SUBMONOLAYER COVERAGE ON HYDROGEN ADSORPTION AT THE STEPPED SURFACES PT(955), PT(322) AND PT(544) IN SULFURIC ACID SOLUTION

机译:亚硫酸盐覆盖不足对铜在阶梯状表面PT(955),PT(322)和PT(544)在硫酸溶液中的氢吸附的影响

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摘要

The effects of coverage by an underpotentially deposited copper submonolayer on hydrogen adsorption were examined for three surfaces ((955), (322) and (544)) of platinum single crystals. A very small amount of copper preferentially blocks the hydrogen adsorption to the (100) step sites. This result supports our previous conclusion (J. Electroanal. Chem., 386 (1995) 75) that the most positive peak of copper underpotential deposition relates to the deposition of copper on the (100) step sites of these three surfaces. [References: 15]
机译:对于铂单晶的三个表面((955),(322)和(544)),研究了欠电位沉积的铜亚单层覆盖对氢吸附的影响。极少量的铜会优先阻止氢吸附到(100)步骤位置。该结果支持了我们先前的结论(J. Electroanal。Chem。,386(1995)75),即铜欠电位沉积的最正峰与这三个表面的(100)台阶位置上的铜沉积有关。 [参考:15]

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