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Fracture Prediction of Adhesively Bonded Structures Using Energy Release Rates

机译:利用能量释放率预测胶粘结构的断裂

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摘要

This paper investigates fracture prediction of adhesively bonded structures using energy release rates. Novel closed-form formulations for calculating energy release rates of adhesive joints and interlaminar delamina-tion are presented and then used to discuss fracture predictions. In the present formulation, the Timoshenko beam is used to model substrates, and an interface between the substrates is described using the adhesive model with two-parameter elastic medium. The energy release rates are initially given for adhesive joints and thereafter are derived for interface fracture by letting the adhesive thickness approach zero. The numerical results are presented for cohesive fracture of an adhesive joint, delamination or interface fracture.
机译:本文研究了利用能量释放速率对粘合结构的断裂预测。提出了用于计算粘合剂接头和层间分层能量释放率的新型封闭形式公式,然后将其用于讨论裂缝预测。在本配方中,使用Timoshenko光束对基材进行建模,并使用带有两参数弹性介质的粘合剂模型来描述基材之间的界面。最初为粘合剂接头提供能量释放速率,然后通过使粘合剂厚度接近零来得出界面断裂的能量释放速率。给出了粘合接头的内聚破裂,分层或界面破裂的数值结果。

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