Microscopic analysis of the wood bond line using liquefied wood as adhesive

摘要

The bonding of beech (Fagus sylvatica L.) with liquefied wood (LW) causes deterioration of the wood surface, resulting in a high percentage of wood failure at a relatively low bond shear strength. Light microscopy, scanning electron microscopy, FT-IR micro-spectroscopy and elemental carbon, nitrogen and sulphur (CNS) analysis techniques were used to investigate the formation of such bonds. It was assumed that the degradation of lignin, hemicellu-loses and parts of the cellulose occurred in the cells of the wood surface where the LW had been applied. At the elevated temperatures occurring during the bonding process, the deteriorated cells were carbonised to some extent. The weak boundary layer of the bond was determined to be a layer of delignified cells located between the zone of partly carbonised cells on the one side and the cells of the undamaged wood of the adherend on the other side. The bonds which formed during the bonding of wood with LW were found to be very untypical compared to bonds formed by synthetic wood adhesives. No adhesive film was formed, the adhesive-adherend interface was not clear and the cells of the adherend subsurface were damaged.