首页> 外文期刊>Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology >Sintering behavior and effect of silver nanoparticles on the resistivity of electrically conductive adhesives composed of silver flakes
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Sintering behavior and effect of silver nanoparticles on the resistivity of electrically conductive adhesives composed of silver flakes

机译:银纳米颗粒的烧结行为及其对由银薄片组成的导电胶的电阻率的影响

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In this paper, silver nanoparticles with size of 30-50nm were synthesized by reducing silver nitrate with sodium borohydride and sodium citrate and using PVP as an adsorption agent in the ethanol solution. The experimental results indicate that the morphologies and sintering behaviors of both kinds of silver nanoparticles are impacted by glutaric acid and sintering temperature. The electrically conductive adhesives (ECAs) filled with micro-sized silver flakes and silver nanoparticles as hybrid fillers were fabricated and the electrical properties were investigated based on the fraction of the silver nanoparticles of the total of silver flakes and the curing temperature, etc. The incorporation of the untreated/treated silver nanoparticles into the polymer matrix with 65 wt% silver filler the resistivity increased in almost all cases, especially the high fraction and the low curing temperature. The curing temperature has influence on the resistivity of the ECAs filled with micro-sized silver flakes and the silver nanoparticles due to the sintering of the silver nanoparticles. The addition of 10% treated silver nanoparticles into the ECAs with 60 wt% silver fillers, the resistivity is slightly lower than that of the ECAs with micro-sized silver flakes. In the system of the ECAs with the high loading of silver fillers, the untreated/treated silver nanoparticles have little effect on the electrical conductivity. The results suggest that the morphology and distribution of silver fillers are the key to affect the conductivity of ECAs when nanoparticles are included in the system.
机译:本文通过用硼氢化钠和柠檬酸钠还原硝酸银,并在乙醇溶液中使用PVP作为吸附剂,合成了尺寸为30-50nm的银纳米粒子。实验结果表明,戊二酸和烧结温度对两种银纳米粒子的形貌和烧结行为都有影响。制备了填充有微米尺寸的银薄片和银纳米颗粒作为混合填料的导电胶(ECA),并根据银薄片中银纳米颗粒的比例和固化温度等对电学性能进行了研究。通过将未处理/已处理的银纳米颗粒掺入具有65 wt%的银填料的聚合物基体中,几乎在所有情况下电阻率都会增加,尤其是高分数和低固化温度时。由于银纳米颗粒的烧结,固化温度对填充有微米级银薄片的ECA和银纳米颗粒的电阻率产生影响。将具有10 wt%的银填料的10%处理过的银纳米颗粒添加到ECA中,其电阻率略低于使用微米级银片的ECA。在具有大量银填料的ECA系统中,未处理/已处理的银纳米粒子对电导率的影响很小。结果表明,当纳米粒子包含在系统中时,银填料的形态和分布是影响ECA电导率的关键。

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