Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives

摘要

Epoxyickel adhesives can be used as integrated circuit (IC) packaging materials due to their lower cost than epoxy/silver adhesives with acceptable electrical conductivity. In this work, conductive epoxy/Ni adhesives were prepared by the solution method and filled into holes connecting the multilayers of a novel prototype designed for use in electronic components in circuit boards, in order to study the geometric effects on the prototype's electrical resistance. An empirical equation was obtained for the contact resistance (R_c) measured after cure. We also show that Ohm's law adequately describes the effects of the bulk adhesive resistance (R_b) on prototype's electrical resistance.