Y-peel characterization of adhesively-bonded carton board:an objective method

摘要

Carton board packages are often closed with an adhesive.The adhesive joint thus formed has to meet the demands during the entire product life from converting to end-use.The adhesive joint has to be characterized if it is good or bad for the actual application.Today such characterization is done by manually peeling the joint,immediately after the adhesive application in the gluing machine.The manual peel test is a subjective test that is operator dependent.An operator needs long experience to be able to perform a manual peel test Therefore,the packaging industry is interested in a test method that can objectively predict good or bad adhesive joints.The adhesive joints have been tested in the so-called Y-peel test arrangement.An advantage of the Y-peel test is that it gives an objective result from the force-elongation curve.Testing has been performed with carton boards of two different thicknesses.Hotmelt adhesive was used and the open time was varied in the glue applicator.It was found that the Y-peel test gives results in qualitative agreement with the manual peel test.Moreover,by evaluating the energy consumption(dissipative energy)during the Y-peel test it was possible to obtain not only a qualitative but also a quantitative assessment of the adhesive joint.