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首页> 外文期刊>Journal of Applied Polymer Science >Relationship Between Structures of Polyacrylonitrile (PAN)-Copper Gradient Composite Film and Electrochemical-Reaction Conditions
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Relationship Between Structures of Polyacrylonitrile (PAN)-Copper Gradient Composite Film and Electrochemical-Reaction Conditions

机译:聚丙烯腈-铜梯度复合膜的结构与电化学反应条件的关系

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摘要

In this article,the relationship between the morphological structure and electrochemical conditions, the crystal structure in the electrochemical deposited phase,and the thermal properties of polyacrylonitrile(PAN)-copper gradient composite films (GCF)were studied.The results showed that the morphology of the GCF depended very much on the electrochemical conditions used in the reactions.The percent area of the deposited phase on the cross section of the GCF decreases with increases of the predrying time of the solution coated on the cathode,the prwer voltage,and the temperature in the electrochemical reactor.According to the data of a differential scanning calorimeter and a scanning electronic microscope,PAN chains are physically crosslinked by a deposited phase.Under the electrochemical conditions used in this article,the components of PAN are not affected by the electrochemical reactions.
机译:本文研究了聚丙烯腈-铜梯度复合膜(GCF)的形貌与电化学条件,电化学沉积相中的晶体结构以及热性能之间的关系。 GCF在很大程度上取决于反应中所用的电化学条件。GCF横截面上沉积相的百分面积随涂覆在阴极上的溶液的预干燥时间,有效电压和温度的增加而降低。根据差示扫描量热仪和扫描电子显微镜的数据,PAN链通过沉积相物理交联。在本文使用的电化学条件下,PAN的成分不受电化学反应的影响。

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