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Reactive partial transient liquid phase diffusion bonding of SiC-SiC

机译:SiC-SiC的反应性部分瞬态液相扩散键

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摘要

Reactive partial transient liquid phase diffusion bonding (R-PTLPB) uses layered filler materials for brazing, which are arranged in a sandwich structure. This structure consists of active element interlayers and a melting point depressing core layer. The reactive PTLP bonding process is applicable to join dissimilar materials (e.g. ceramic- metal-systems) as well as similar materials (e.g. ceramic-ceramic-systems). Additionally, bonds produced with this process offer some special features, such as a re-melting temperature which is higher than the brazing temperature and a good control of the occurring reactions. Hence, these bonds are well suitable for high temperature applications or to bond thermally sensitive materials. In the present study, the reactive PTLP bonding process was investigated and qualified to join a SiC-SiC system. For this purpose, titanium and zirconium were deposited on ceramic surfaces as active interlayers by means of physical vapor deposition (Arc-PVD). Nickel foils were employed as metallic core interlayers. The effects of the active elements on the forming microstructure and the porosity of the brazing zone were investigated at different brazing temperatures and with different holding times.
机译:反应性部分瞬态液相扩散粘结(R-PTLPB)使用分层的钎料填充材料,这些材料以三明治结构排列。该结构由活性元素夹层和降低熔点的芯层组成。反应性PTLP键合工艺适用于连接异种材料(例如陶瓷-金属系统)以及相似材料(例如陶瓷-陶瓷系统)。另外,用这种方法生产的粘结物具有一些特殊的特性,例如高于钎焊温度的重熔温度和对发生的反应的良好控制。因此,这些粘结非常适合高温应用或粘结热敏材料。在本研究中,对反应性PTLP键合工艺进行了研究,并有资格加入SiC-SiC系统。为此,通过物理气相沉积(Arc-PVD)将钛和锆作为活性夹层沉积在陶瓷表面上。镍箔被用作金属芯中间层。在不同的钎焊温度和不同的保温时间下,研究了活性元素对钎焊区成形组织和孔隙率的影响。

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