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Experimental simulation study of intersplat bonding formation by deposition of YSZ-splats on preheated YSZ substrate

机译:在预热的YSZ基底上沉积YSZ-splats形成金属间键合的实验模拟研究

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摘要

Yttria stabilized zirconia (YSZ) splats were plasma sprayed on the YSZ substrate preheated to different temperature to examine the influence of the temperature of the underlying surface on which molten droplet impacts on deposition characteristics. The splat morphology and the bonding at the splat-substrate interfaces were examined by SEM. It was found that the crack density decreases rapidly with the increase of the temperature when the splat were formed on an YSZ substrate preheated to above 800℃. The nucleation of YSZ melt on the base of YSZ substrate grains takes place during solidification leading to the formation of the bonding between the splat and substrate when the temperature is increased to over 600℃. The substantial bonding was observed at the interface between YSZ splat and YSZ substrate as the temperature is increased to over 800℃. The results revealed that the temperature of the previous splat on which a molten droplet impacts significantly influence the formation of the interface bonding. In addition, the mechanism and condition for the bonding formation of a splat on a substrate with the identical compositions were discussed.
机译:在预热至不同温度的YSZ基板上等离子喷涂氧化钇稳定的氧化锆(YSZ)片,以检查下表面温度对熔融液滴影响沉积特性的影响。通过SEM检查了splat的形态和在splat-基板界面处的结合。发现在预热至800℃以上的YSZ基板上形成裂纹时,裂纹密度随温度的升高而迅速降低。在凝固过程中,YSZ熔体在YSZ基体晶粒的基础上成核,导致温度升至600℃以上时,在Splat和基体之间形成粘结。当温度升高到800℃以上时,在YSZ splat和YSZ基板之间的界面上观察到了牢固的结合。结果表明,熔融液滴撞击其上的前一个喷口的温度显着影响界面结合的形成。另外,讨论了在具有相同组成的基材上形成splat的键合机理和条件。

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