Micro-application of glass solders for micro-technological production techniques

摘要

The research study about micro-applications of glass solders explored high-precision applications of glass solderThe researchers were able to demonstrate that commercially available glass solder powders can be processed to become dispensable pastes which are suitable for high-precision application, the application of solder pastes with simple time/pressure cartridge dispensers is capable of delivering good results concerning application volume and speed, the dispenser parameters strongly depend on the paste properties and need to be established anew for every new type of paste used, the paste production and preparation techniques have a decisive impact on both quality and reliability of the solder application.Application techniques were developed and then tested on a number of demonstrators. It was established that -in contrast to other bonding techniques such as adhesive bonding-the glass soldering technology cannot be readily transferred to existing configurations of components, even if the thermal expansion coefficients of all bonding partners have been adapted. For best results, construction and design of the bonding partners must be adapted to the specific requirements of the soldering technique, for instance the high level of thermal stress during the soldering.The application and soldering techniques under review allow to open up a wide range of applications for micro-technological components made from glass and ceramic materials.