首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >Influence of discharge power and annealing temperature on the properties of indium tin oxide thin films prepared by pulsed-DC magnetron sputtering
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Influence of discharge power and annealing temperature on the properties of indium tin oxide thin films prepared by pulsed-DC magnetron sputtering

机译:放电功率和退火温度对脉冲直流磁控溅射制备铟锡氧化物薄膜性能的影响

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摘要

Indium tin oxide (ITO) films, prepared by a pulsed direct current magnetron sputtering system, are investigated at powers from 0.4 to 2.0 kW (power density in the range 0.8-4.1 W/cm(2)). It is found that the carrier concentration and crystallinity of the ITO films increase with increasing discharge power, while the electron mobility decreases from 49.2 cm(2)/Vs at 0.4 kW to 303 cm(2)/Vs at 2.0 kW. X-ray photoelectron spectroscopy measurements demonstrate that the ITO films prepared at high powers have more oxygen deficient and Sn4+ bonding states. These two types of bonding states are most relevant to the oxygen vacancies and substitutional tin atoms, which are the dominant electron donors in ITO. This observation explains why highly conductive ITO films are achieved at high deposition powers. Besides the investigation of the as-deposited ITO properties, annealing induced changes are explored in air ambient. The ITO properties are maintained for most of the samples when annealed at 150 degrees C, while degraded ITO properties are observed when annealed at 200 degrees C, especially for films grown at low powers. The annealing induced changes are most probably related to changes of the film crystallinity. A clear improvement of the crystallinity is observed for low power deposited ITO films after annealing at 200 degrees C for 240 min. (C) 2015 Elsevier Ltd. All rights reserved.
机译:研究了通过脉冲直流磁控溅射系统制备的铟锡氧化物(ITO)膜的功率为0.4至2.0 kW(功率密度在0.8-4.1 W / cm(2)范围内)。发现随着放电功率的增加,ITO膜的载流子浓度和结晶度增加,而电子迁移率从0.4 kW时的49.2 cm(2)/ Vs降低到2.0 kW时的303 cm(2)/ Vs。 X射线光电子能谱测量表明,高功率制备的ITO薄膜具有更多的缺氧和Sn4 +键合态。这两种类型的键合状态与氧空位和取代锡原子最相关,后者是ITO中的主要电子供体。该观察解释了为什么在高沉积功率下获得高导电性ITO膜的原因。除了研究沉积的ITO特性外,还在空气环境中探索退火引起的变化。在150℃退火时,大多数样品的ITO性能得以保持,而在200℃退火时,则观察到ITO性能下降,尤其是在低功率下生长的薄膜。退火引起的变化很可能与膜结晶度的变化有关。在200摄氏度下退火240分钟后,低功率沉积的ITO薄膜的结晶度有了明显改善。 (C)2015 Elsevier Ltd.保留所有权利。

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