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首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >Crystallization phase transition in the precursors of CIGS films by Ar-ion plasma etching process
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Crystallization phase transition in the precursors of CIGS films by Ar-ion plasma etching process

机译:Ar离子等离子体刻蚀工艺在CIGS薄膜前体中的结晶相变

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摘要

Mixed alloy Cu-In-Ga precursors were deposited from Cu-Ga alloy and Indium targets by the DC magnetron co-sputtering method. There were four crystallization phases, In, CuIn_2, Cu_(11)In_9 and Cu_3Ga, identified in the precursor after deposition. A large grain-size CIGS film was achieved by controlling the annealing period for selenization and utilizing a two-stage selenization process for secondary crystallization during rapid thermal annealing process. As the annealing temperature increased, the phase transitions moved toward the Cu-rich inter-metallic phases. In addition, the phase transition, stoichiometric ratio and surface-morphology were modified by Ar-ion plasma etching process of the precursors. The results show that after the ion etching process, the precursors can be transferred into a single Cu_(11)In_9 crystallization phase and the number of crevices increased due to the soft texture of indium on the surface of the precursors. Finally, CIGS films with good crystalline properties were achieved after a suitable selenization process of only 1-stage.
机译:通过直流磁控共溅射法从铜镓合金和铟靶中沉积出混合合金铜铟镓前驱体。在沉积后的前体中鉴定出四个结晶相:In,CuIn_2,Cu_(11)In_9和Cu_3Ga。通过控制硒化的退火时间并在快速热退火过程中利用二级硒化过程进行二次结晶,可制得大晶粒尺寸的CIGS膜。随着退火温度的升高,相变向富铜金属间相移动。另外,通过前驱体的Ar离子等离子体刻蚀工艺对相变,化学计量比和表面形貌进行了修饰。结果表明,经过离子刻蚀后,前驱体可以转移到一个单一的Cu_(11)In_9结晶阶段,并且由于前驱体表面铟的柔软质地,缝隙数量增加。最后,经过仅1阶段的适当硒化处理,即可获得具有良好结晶性能的CIGS薄膜。

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