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Miniature SAW Device for RF-Wireless Applications Using MEMS Technology

机译:使用MEMS技术的射频无线应用微型SAW器件

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摘要

A miniature SAW device is designed and fabricated at 1 GHz for wireless communication system. A 5 μm thin film of ZnO is successfully deposited using RF sputtering technique on PECVD SiO{sub}2 layer of 1 μm on top of Si wafer under various operating conditions. The c-axis oriented ZnO film exhibit a sharp diffraction peak corresponding to the (002) reflection at 2θ =34.42. The fabrication process utilizing the MEMS technology of the SAW device is described. Simulation of the RF SAW filter is performed. Measurements and experimental work are presented for the RF SAW device.
机译:设计和制造了用于无线通信系统的1 GHz微型SAW器件。在各种操作条件下,使用RF溅射技术成功地在Si晶片顶部的1μmPECVD SiO {sub} 2层上沉积了5μmZnO薄膜。 c轴取向的ZnO膜在2θ= 34.42处显示出与(002)反射相对应的尖锐衍射峰。描述了利用SAW器件的MEMS技术的制造过程。进行RF SAW滤波器的仿真。介绍了射频声表面波设备的测量和实验工作。

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