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Concentration effect of copper loading on the reductive dechlorination of tetrachloroethylene by zerovalent silicon.

机译:铜负载对零价硅对四氯乙烯还原脱氯的影响。

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The dechlorination of tetrachloroethylene (PCE) by zerovalent silicon (Si(0)) in the presence of low concentration of Cu(II) ion was investigated under anaerobic conditions. The mass loadings of Cu(II) in the Si(0)-H(2)O system were in the range 0.06-3 wt% (0.02-1 mM). In addition, the X-ray photoelectron spectroscopy (XPS) and electron probe microanalysis (EPMA) were used to characterize the change in chemical species and distribution patterns of metals, respectively. Results showed that the pre-incubation time of 3 d was needed to activate the reactive sites of Si(0) before the dechlorination of PCE. Addition of low concentration of Cu(II) at 0.06 wt% significantly enhanced the dechlorination of PCE, while high concentration of Cu(II) would occupy the reactive sites of Si(0), and subsequently decreased the dechlorination efficiency and rate of PCE. The pseudo first-order rate constant (k(obs)) for PCE dechlorination by 0.06 wt% Cu/Si was 0.028 h(-1), which was 2.8 times higher than that by Si(0) alone. However, the k(obs) for PCE dechlorination decreased to 0.0016 h(-1) when the loading of Cu(II) increased to 3 wt%. The EPMA results showed that the distribution of 0.06 wt% Cu on the Si(0) surface was homogeneous without any aggregation, which means that the maximum rate constant was observed before the total coverage of the active sites on the reductive metal by the catalytic metal layer. The surface coverage of Cu to Si(0) can theoretically calculate by estimation of the lowest energy fcc(111) crystallographic orientation. The calculated surface coverage of 0.06 wt% Cu onto Si(0) was approximately 43%, which is consistent with the experimental results obtained in this study.
机译:在厌氧条件下研究了在低浓度的Cu(II)离子存在下零价硅(Si(0))对四氯乙烯(PCE)的脱氯作用。 Si(0)-H(2)O系统中Cu(II)的质量负载范围为0.06-3 wt%(0.02-1 mM)。此外,X射线光电子能谱(XPS)和电子探针微分析(EPMA)分别用于表征金属的化学种类和分布模式的变化。结果表明,在PCE脱氯之前,需要3 d的预孵育时间来激活Si(0)的反应位点。添加0.06 wt%的低浓度Cu(II)会显着增强PCE的脱氯作用,而高浓度的Cu(II)将占据Si(0)的反应部位,从而降低PCE的脱氯效率和速率。用0.06 wt%Cu / Si对PCE脱氯的拟一级反应速率常数(k(obs))为0.028 h(-1),比单独使用Si(0)时高2.8倍。但是,当Cu(II)的负载量增加到3 wt%时,PCE脱氯的k(obs)降低到0.0016 h(-1)。 EPMA结果表明,0.06 wt%的Cu在Si(0)表面分布均匀,没有任何聚集,这意味着在催化金属完全覆盖还原金属上的活性位点之前,观察到最大速率常数。层。理论上,可以通过估计最低能量fcc(111)晶体取向来计算Cu对Si(0)的表面覆盖率。计算得出的Si(0)上0.06 wt%Cu的表面覆盖率约为43%,这与本研究中获得的实验结果是一致的。

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