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An analytical, temperature-dependent model for majority- and minority-carrier mobility in silicon devices

机译:硅器件中主要载流子和少数载流子迁移率的温度依赖性分析模型

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A new analytical model for carrier mobility in silicon is presented, which is strongly oriented to CAD and suitable for implementation in device simulators. The effects of the electric field, temperature, and doping concentration are accounted for. In particular, the model unifies the descriptions of majority- and minority-carrier mobility and includes the full temperature dependence. The effects of a high longitudinal field are included in the conventional velocity-saturation form; the doping dependence is also incorporated in the latter. The model has been worked out starting from a preliminary investigation using a Boltzmann solver, and has been validated by a number of comparisons with published experiments on silicon. [References: 20]
机译:提出了一种针对硅中载流子迁移率的新分析模型,该模型强烈地面向CAD,适用于在器件仿真器中实施。考虑了电场,温度和掺杂浓度的影响。尤其是,该模型统一了多数和少数载流子迁移率的描述,并包括了完全的温度依赖性。在传统的速度饱和形式中包括了高纵向磁场的影响。掺杂依赖性也被并入后者。该模型已从使用Boltzmann求解器的初步研究开始进行设计,并已通过与硅上已发表实验的大量比较进行了验证。 [参考:20]

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