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首页> 外文期刊>Tribology letters >Core/Shell Structured Solid-Silica/Mesoporous-Silica Microspheres as Novel Abrasives for Chemical Mechanical Polishing
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Core/Shell Structured Solid-Silica/Mesoporous-Silica Microspheres as Novel Abrasives for Chemical Mechanical Polishing

机译:核/壳结构固体二氧化硅/中孔二氧化硅微球作为化学机械抛光的新型磨料

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摘要

The allotropic silica microsphere as a novel abrasive, which consisted of a solid-silica (SSiO2) core and a mesoporous-silica shell (MSiO2), was introduced into chemical mechanical polishing (CMP) process. The shell thickness of the core/shell structured SSiO2/MSiO2 microspheres was tailored by adjusting the amount of cetyltrimethylammonium bromide (mesoporous template) and tetraethylorthosilicate (silica source). The obtained SSiO2/MSiO2 samples were structurally confirmed by small-angle X-ray diffraction, transmission electron microscopy, field-emission scanning electron microscopy and nitrogen adsorption-desorption technique. The results of oxide CMP experiments revealed that the SSiO2/MSiO2 abrasives exhibited higher material removal rate (=269 nm/min), lower root-meansquare (=0.203 nm) surface roughness as well as lower topographical variations than those of conventional solid-silica abrasives (137 nm/min, 0.343 nm). The enhanced CMP performance might be attributed to the optimization of the real contact environments between abrasives and substrates based on the synergetic aspects of chemical corrosion and mechanical abrasion. These results suggested that the core/shell structured SSiO2/MSiO2 abrasives presented an important potential application in efficient and damage-free polishing. This work will provide experimental and theoretical basis for the design and application of porous abrasives or core/shell structured composites with porous shells in CMP.
机译:将由固体二氧化硅(SSiO2)核和中孔二氧化硅壳(MSiO2)组成的新型同素异形二氧化硅微球引入化学机械抛光(CMP)工艺中。通过调节十六烷基三甲基溴化铵(介孔模板)和原硅酸四乙酯(二氧化硅源)的量来定制核/壳结构化SSiO2 / MSiO2微球的壳厚度。通过小角X射线衍射,透射电子显微镜,场发射扫描电子显微镜和氮吸附-脱附技术对所得的SSiO2 / MSiO2样品进行结构确认。氧化物CMP实验的结果表明,与传统的固态二氧化硅相比,SSiO2 / MSiO2磨料具有更高的材料去除率(= 269 nm / min),更低的均方根(= 0.203 nm)表面粗糙度以及更低的形貌变化研磨剂(137 nm / min,0.343 nm)。增强的CMP性能可能归因于化学腐蚀和机械磨损的协同作用,从而优化了磨料与基材之间的实际接触环境。这些结果表明,核/壳结构的SSiO2 / MSiO2磨料在有效且无损伤的抛光方面具有重要的潜在应用。这项工作将为CMP中具有多孔壳的多孔磨料或核/壳结构复合材料的设计和应用提供实验和理论基础。

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