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Optimization of Hard Gold Plating for Electrical Contacts

机译:电触头硬金镀层的优化

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摘要

One of the most important factors, which determine the lifetime of gold plated electrical contacts is the tri-bological behavior of gold plate, which can be significantly influenced by both the kind and the amount of alloying elements. The lifetime, the electrical and tribological properties of electrical contacts with different kinds and different amounts of alloying elements are investigated. The results of the investigation are used to compare the lifetime, the electrical and tribological properties of different modified gold platings. They are important bases for the optimization of gold plating. The investigation shows that an increased lifetime can be achieved by an optimization of the amount of alloy element in gold. But the potential for the optimization of the amount of alloy element is limited. The modification of the gold plating by means of nanoscale particles seems to have a larger potential. The key issues of nanoscale particles are particle size distribution and particle distribution in plating.
机译:决定镀金电触头寿命的最重要因素之一是镀金的摩擦学行为,它可能会同时受到合金元素的种类和数量的影响。研究了不同种类和不同合金元素含量的电触头的寿命,电学和摩擦学性能。研究结果用于比较不同改性金镀层的寿命,电学和摩擦学性能。它们是优化镀金的重要基础。研究表明,通过优化金中合金元素的含量可以延长使用寿命。但是优化合金元素含量的潜力有限。借助于纳米级颗粒对镀金的改性似乎具有更大的潜力。纳米级颗粒的关键问题是粒径分布和电镀中的颗粒分布。

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