Influence of colloidal abrasive size on material removal rate and surface finish in SiO{sub}2 chemical mechanical polishing

摘要

Have you ever wondered how electronics manufacturers have been able to reduce the cost of a VCR by over a factor of ten in the past decade? It is partly the economies of scale...they are making lots of them and this drives unit costs down. It is also partly because new and better manufacturing processes minimize waste and cut production time and cost. This paper gives some clues as to what goes on behind the scenes to achieve better efficiency in the manufacture of integrated circuits. Before a microchip can be made, a thin wafer of silicon must be cut from a single crystal bar and polished to a nearly flat, perfectly smooth surface. Onto this mirror-like silicon platform are deposited the microscopic resistors, transistors and other electronic components that make up the electronic heart and brains of modern devices. To get this wafer smooth in the least time, Tribology researchers study the effects of polishing parameters on surface finish and material removal rates. Their results, like those shown in this paper, help reduce waste and cost and help to make technology more available and affordable for all. Appeared in Tribology Transactions, April 2002.