Embedded Passives: 3-D Integrated Component Printed Circuit Boards

摘要

Electronics have surrounded us since the development of the solid-state radio; but in the lost decade, electronics have become personal in the forms of quartz watches and mobile phones and have accompanied us everywhere in our daily activities. The key to the proliferation and penetration of personal electronics devices in our daily activities has been the miniaturisation and the functional enhancement enabled by advances in silicon integration technologies. In comparison, integration of non-silicon components in electronic devices had lacked behind. The driver for functional integration and miniaturisation is now driving the integration of non-silicon components into polymeric printed circuit boards. The technology is in the transition stage, but it is dear that the integration of non-silicon components into polymeric circuit boards and substrates will bring about an impact on a similar scale of that produced by silicon integration technologies. The key technologies and advances in embedding resistors, inductors and capacitors underpinning this shift are reviewed in this article. The application and market outlook of the embedded passive technologies are then reviewed.