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首页> 外文期刊>Surface & Coatings Technology >Reactive magnetron sputtering of tin-doped indium oxide (ITO): influence of argon pressure and plasma excitation mode
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Reactive magnetron sputtering of tin-doped indium oxide (ITO): influence of argon pressure and plasma excitation mode

机译:掺锡氧化铟(ITO)的反应磁控溅射:氩气压力和等离子体激发模式的影响

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摘要

Tin-doped indium oxide (ITO) films have been prepared by reactive magnetron sputtering from it metallic alloy target onto unheated substrates. In a systematic study, the influence of the working pressure and the discharge mode (DC, Pulsed DC or RF) on the electrical and structural properties of ITO films was investigated. It was found that the RF excitation (13.56 MHz) of a magnetron discharge is the most effective one with respect to the usage of the oxygen for oxidising the sputtered metal atoms on the substrate surface. When varying the working pressure (0.3-3.4 Pa), the oxygen partial pressure for the resistivity minimum of the ITO films is independent of the working pressure for RF excitation. Exciting the plasma by DC, an increasing oxygen amount is necessary in order to prepare low resistant ITO films when increasing the working pressures. This behaviour can be explained by different sources for the input of energetic particles into the growing film for RF and DC excitation. In a DC discharge, most of the energetic particles stem from the target surface (e.g. reflected neutral argon atoms or negative oxygen ions), while in a RF magnetron discharge, the largest part of the energetic particles has its origin in the plasma in front of the substrate. By Rutherford backscattering analysis the chemical composition of the ITO films as a function of the oxygen partial pressure was investigated. Fully oxidised ITO films exhibit an oxygen excess of approximately 15%. Low resistant ITO films show an oxygen-to-metal ratio of approximately 1.5, suggesting a film structure where the tin atoms occupy indium lattice sites. From the XRD analysis, a compressive strain in the ITO films of up to 2% was measured, which seems to be caused by the excess oxygen in the films. Furthermore, the ITO films exhibit a density which is up to Mlo lower than that of bulk indium oxide. (C) 2001 Elsevier Science BN. All rights reserved. [References: 24]
机译:锡掺杂的氧化铟(ITO)膜已通过反应磁控溅射法从金属合金靶材溅射到未加热的基板上制备。在系统的研究中,研究了工作压力和放电方式(直流,脉冲直流或射频)对ITO膜的电学和结构性能的影响。已经发现,就使用氧气氧化衬底表面上溅射的金属原子而言,磁控管放电的RF激励(13.56MHz)是最有效的。当改变工作压力(0.3-3.4 Pa)时,ITO膜电阻率最小值的氧分压与RF激发的工作压力无关。通过DC激发等离子体,增加氧气含量是必要的,以便在增加工作压力时制备低电阻的ITO膜。这种行为可以通过将高能粒子输入到生长膜中以进行RF和DC激发的不同来源来解释。在DC放电中,大多数高能粒子都来自目标表面(例如反射的中性氩原子或负氧离子),而在RF磁控管放电中,最大的高能粒子起源于等离子体中的等离子体。基板。通过卢瑟福反向散射分析,研究了ITO膜的化学组成随氧分压的变化。完全氧化的ITO膜的氧气过量约为15%。低电阻ITO膜的氧金属比约为1.5,表明其中锡原子占据铟晶格位点的膜结构。根据XRD分析,测得ITO薄膜中的压缩应变高达2%,这似乎是由于薄膜中的氧气过多所致。此外,ITO膜表现出的密度比块状氧化铟的密度低多达Mlo。 (C)2001 Elsevier Science BN。版权所有。 [参考:24]

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