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A comparative study of electronic properties of the defects introduced in p-Si: (i) During electron beam deposition of Ti/Mo, (ii) by proton irradiation, and (iii) by electron irradiation

机译:p-Si中引入的缺陷的电子性质的比较研究:(i)电子束沉积Ti / Mo期间,(ii)质子辐照,和(iii)电子辐照

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摘要

The electronic properties of defects introduced unintentionally, during electron beam deposition (EBD) of Ti and Mo on Cz grown, B-doped Si and those deliberately introduced by proton and electron irradiation are presented in this paper. Deep level transient spectroscopy (DLTS) studies on the samples revealed the following primary hole traps at 0.32 eV and 0.54 eV above the valence band after EBD processing. 0.15 eV, 0.32 eV after proton irradiation and 0.17 eV, 0.23 eV, 0.33 eV and 0.60 eV after electron irradiation. The comparison of the defect levels showed one common defect level at 0.32 eV above the valence band in the three radiation processed samples, and this hole trap is boron related. Most of the defect levels, created in these three samples, are not similar. Higher defect introduction rates were recorded for the proton when compared to the electron irradiation induced primary deep level states. We have also briefly discussed the annealing behaviour of these primary defect levels.
机译:本文介绍了在Cz上生长Ti和Mo的电子束沉积(EBD),B掺杂的Si以及通过质子和电子辐照故意引入的缺陷的电子性质。对样品的深层瞬态光谱法(DLTS)研究表明,在EBD处理后,在价带上方0.32 eV和0.54 eV处存在以下主要空穴陷阱。质子辐照后为0.15 eV,0.32 eV,电子辐照后为0.17 eV,0.23 eV,0.33 eV和0.60 eV。缺陷水平的比较显示,在三个经过辐射处理的样品中,一个比价带高0.32 eV的常见缺陷水平,该空穴陷阱与硼有关。在这三个样本中创建的大多数缺陷级别都不相似。与电子辐照引起的初级深能级状态相比,质子记录了更高的缺陷引入率。我们还简要讨论了这些主要缺陷水平的退火行为。

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