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Effects of substrate bias voltage on projection growth in chromium nitride films deposited by arc ion plating

机译:衬底偏置电压对电弧离子镀沉积氮化铬膜凸出生长的影响

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Projection growth in chromium nitride films deposited by arc ion plating was studied as a function of substrate bias voltage by scanning electron microscope and stylus instrument. Most of projections were observed as the tops of tapered crystallite developed on droplets. Most of the droplets were implanted under the projections, although there existed some droplets on film surface. And growth morphology of projections on droplets was strongly affected by substrate bias voltage. Under the condition of low substrate bias voltage, projections grew larger than droplets to roughen the film surface. On the other hand, under the condition of high bias voltage, diameters of projections were smaller than the droplets to be embedded to flatten the surface as film deposition progresses further. Then, the number and size of projections on film surfaces and surface roughness of the film decreased with an increase in substrate bias voltage. Besides, droplets adhering on film surface shadowed the underlying film from further deposition of chromium nitride, resulting in the appearance of toroidal shaped voids along the droplets. Though these toroidal shaped voids developed upward from the shaded bottom surface along the droplets at low bias voltage, these voids became smaller to be detected just beneath the droplet at the higher bias voltage. These results imply that the resputtering effect on geometrical projections, strengthened by the increase in substrate bias voltage, as generally accepted, would cause the decrease of the deposition rate on projections much more than on the flat surface of the film, and resputtered materials would also fill the space between the droplets and the film surface, resulting in the embedment of projections as film deposition progresses.
机译:通过扫描电子显微镜和测针仪研究了电弧离子镀沉积的氮化铬膜的投影生长与衬底偏压的关系。观察到的大多数投影是在液滴上形成的锥形微晶的顶部。尽管在膜表面上存在一些液滴,但是大多数液滴被植入到突起下方。液滴上的投影的生长形态受衬底偏压的强烈影响。在低基板偏置电压的条件下,突起变得比液滴大,从而使膜表面粗糙。另一方面,在高偏置电压的条件下,随着膜沉积的进一步发展,突起的直径小于要被嵌入以使表面平坦的液滴的直径。然后,随着基板偏置电压的增加,膜表面上的突起的数量和大小以及膜的表面粗糙度减小。此外,粘附在膜表面上的液滴遮盖了下面的膜,防止了氮化铬的进一步沉积,导致沿液滴出现环形空隙。尽管这些环形空隙在低偏压下从阴影底表面沿液滴向上发展,但这些空隙变得较小,仅在较高偏压下正好在液滴下方被检测到。这些结果暗示,如通常所接受的那样,通过增加衬底偏置电压而增强的对几何突起的再溅射效果将导致突起上的沉积速率的降低远大于在膜的平坦表面上的沉积速率,并且再溅射的材料也将导致填充液滴和薄膜表面之间的空间,导致随着薄膜沉积的进行而嵌入凸起。

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