Formulation of the low-temperature tin-copper eutectic solder joining process was considered to be a rather technically unexciting field until Tetsuro Nishimura's discovery that a very small, but very specific addition of nickel could turn the economical, but rather difficult-to-use, tin-copper eutectic into a very user friendly lead-free solder. The fact that ten years after this discovery and its introduction to commercial mass production the resulting alloy, known as SN100C~R, enjoys a substantial and growing share of the global market for lead-free solders for electronics assembly is confirmation that there has indeed been a revolution in solder alloy formulations.
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