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Mesoscale Scanning Electron and Tunneling Microscopy Study of the Surface Morphology of Thermally Annealed Copper Foils for Graphene Growth

机译:用于石墨烯生长的热退火铜箔的表面形貌的中尺度扫描电子和隧道显微镜研究

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摘要

The evolution of the surface morphology of thermally annealed copper foils utilized for graphene growth by Chemical Vapor Deposition (CVD) has been studied by Scanning Tunneling Microscopy, Scanning Electron Microscopy, and optical microscopy to determine the effect of pretreatment and preannealing steps that aimed to increase grain size and reduce surface roughness for subsequent graphene growth. The results of the study show that (a) Fe(NO3)3 etch pretreatment leaves residue and etch quarries on the Cu surface even after thermal annealing, (b) certain preannealing processes yield a crust layer on the foil that can peel off, (c) graphene film can preserve an imprint of the Cu film grain structure after being transferred onto SiO2 substrate, and (d) graphene/Cu surface height variations remain much larger than the diameter of the carbon atom over micrometer length scales. Nevertheless, good quality graphene can be grown on the rough Cu surface, and a layer of graphene on top of the copper reduces its apparent surface roughness.
机译:已通过扫描隧道显微镜,扫描电子显微镜和光学显微镜研究了用于化学气相沉积(CVD)的石墨烯生长的热退火铜箔的表面形态演变,以确定旨在提高其预处理效果和预退火步骤的效果晶粒尺寸减小并降低随后的石墨烯生长的表面粗糙度。研究结果表明(a)即使经过热退火,Fe(NO3)3蚀刻预处理也会在Cu表面留下残留物和蚀刻碎石;(b)某些预退火过程会在箔片上形成一层可剥落的结壳层,( c)石墨烯薄膜在转移到SiO2衬底上之后可以保留Cu薄膜晶粒结构的烙印,并且(d)石墨烯/ Cu表面高度变化在微米长度尺度上仍远大于碳原子的直径。不过,可以在粗糙的Cu表面上生长高质量的石墨烯,并且在铜的顶部形成一层石墨烯可以降低其表面粗糙度。

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