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Measurement of Temperature Distribution and Thermal Stress Analysis in SN Plate

机译:SN板中温度分布的测量和热应力分析

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摘要

One form of damage on SN plate is cracking. It is necessary to determine the temperature and stress distribution within SN plate in order to eliminate such cracking. We confirm that the simulated results of temperature distribution by FEM (finite element method) in the heating experiment agrees with the actually measured temperature distribution results. Furthermore, we analyze thermal stress (distribution) analysis by FEM under operating conditions. As a result, the analysis shows that the numerical estimation for crack formation coincides well with the actual crack profiles. The location of the cracking depends on the confinement condition of the SN plate. We demonstrate that four-sided confinement was the optimal for the elimination of cracking.
机译:SN板上的一种损坏形式是开裂。为了消除这种裂纹,有必要确定SN板内的温度和应力分布。我们确认加热实验中通过有限元法(有限元法)模拟的温度分布结果与实际测得的温度分布结果一致。此外,我们在运行条件下通过有限元分析热应力(分布)分析。结果表明,裂纹形成的数值估计与实际裂纹轮廓吻合良好。裂纹的位置取决于SN板的限制条件。我们证明了四面约束是消除裂纹的最佳选择。

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