Glass Cap Packaged High Isolating Ka-Band RF-MEMS Switch

摘要

This paper presents a packaged high-isolation RF-MEMS switch at Ka-band. The package consists of a glass cap with a milled cavity to protect the RF-MEMS. The glass cap, with a low dielectric constant, is bonded to the silicon substrate using ultraviolet light curable glue in a room temperature process. The packaging is non hermetic but able to withstand water and dust for a limited time period. The switch shows an isolation of 50 dB and an insertion loss of 0.8 dB at 30 GHz. The additional loss due to the package was found to be only 0.1 dB.