A distributed systems model for estimation of printed circuit board fabrication costs

摘要

Newer product development methods in distributed manufacturing environments have been increasing in their popularity and use, serving to provide desirable advantages over conventional manufacturing approaches developed for vertically integrated environments. Manufacturing planning has evolved from materials requirements planning (MRP) through MRP II, JIT, flexible manufacturing and lean manufacturing. While the strategies themselves represent improvement towards meeting current goals when compared with their earlier counterparts, they have brought with them a new and different set of shortcomings. This paper focuses on the distributed manufacturing of printed circuit boards. Issues that arise from the nature of the relationships between the cooperating enterprises are discussed from the viewpoint of overall efficiency of the system. The nature and extent of the information shared is reviewed, and the implications and viability of distributed information systems are discussed. Finally, we present a methodology designed for implementation within an existing framework of distributed manufacturing. This distributed information systems approach serves to integrate the upstream design function with the printed circuit board fabrication function without compromising the proprietary information elements of the individual collaborating enterprises. Preliminary results are presented which serve to highlight the advantages and potential reductions in time-to-market and product costs by improving the responsiveness of the information loop. Further, the methodology achieves reduced design and printed circuit board fabrication costs by taking advantage of specific capabilities of the participating firms.