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首页> 外文期刊>Proceedings of the Institution of Mechanical Engineers, Part B. Journal of engineering manufacture >A geometrical-mechanical-thermal predictive model for thermal contact conductance in vacuum environment
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A geometrical-mechanical-thermal predictive model for thermal contact conductance in vacuum environment

机译:真空环境下热接触传导的几何-机械-热预测模型

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In this article, a comprehensive geometrical-mechanical-thermal predictive model is developed for thermal contact conductance between two flat metallic rough surfaces. The rough surface was characterized by Weierstrass-Mandelbrot fractal function. The micro-morphology was measured by laser microscope to identify the fractal parameters that were then applied to mechanical and thermal modeling. A new contact mechanics model was then proposed to calculate the contact parameters, and different contact scales between asperities and three modes of deformation, elastic, elastic-plastic and fully plastic, were taken into account. The normal contact pressure, which should be equal to the exterior load, was formulated as a function of the fractal parameters, the maximum contact area and the material physical properties of the given surface. Based on the contact mechanics model, first a single pair of contacting asperities was proposed and then multi-contacting asperities were combined to get total thermal contact conductance. The influences of contact load, surface roughness, asperity top radius and contact area as well as the temperature on the thermal contact conductance were investigated by using the proposed model. The investigation results showed that thermal contact conductance increases with the contact load and contact area. The larger the surface roughness, the smaller is the thermal contact conductance. Finally, the experiments were conducted to validate the effectiveness of the thermal contact conductance modeling. This geometrical-mechanical-thermal predictive model was compared with the two existing predictive models and a series of experimental data. The results showed good agreement, demonstrating the validity of the model and providing certainty for further study on the heat transfer between contact surfaces.
机译:在本文中,为两个平坦的金属粗糙表面之间的热接触传导建立了一个综合的几何-机械-热预测模型。粗糙表面的特征在于Weierstrass-Mandelbrot分形函数。通过激光显微镜测量微观形貌以鉴定分形参数,然后将其应用到机械模型和热模型中。然后提出了一个新的接触力学模型来计算接触参数,并考虑了粗糙和三种变形模式(弹性,弹塑性和全塑性)之间的不同接触尺度。正常接触压力应等于分形参数,最大接触面积和给定表面的材料物理性能的函数,该压力应等于外部载荷。基于接触力学模型,首先提出一对接触粗糙体,然后将多接触粗糙体相结合以获得总的热接触电导率。利用所提出的模型,研究了接触载荷,表面粗糙度,凹凸不平半径,接触面积以及温度对热接触电导率的影响。研究结果表明,热接触电导率随接触载荷和接触面积的增加而增加。表面粗糙度越大,热接触电导越小。最后,进行了实验以验证热接触电导建模的有效性。将该几何-机械-热预测模型与两个现有的预测模型和一系列实验数据进行了比较。结果显示出良好的一致性,证明了该模型的有效性,并为进一步研究接触表面之间的传热提供了确定性。

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