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首页> 外文期刊>Proceedings of the Institution of Mechanical Engineers, Part B. Journal of engineering manufacture >Application of optical force measurement to mode characterization of atomic force microscopy nanomachining
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Application of optical force measurement to mode characterization of atomic force microscopy nanomachining

机译:光学力测量在原子力显微镜纳米加工模式表征中的应用

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Atomic force microscopy is often used not only to acquire the sample surface topography at the subnanometer scale but also to measure forces on the surface during imaging. This study aims to develop a practical measurement scheme of the actual scratching forces exerted during atomic force microscopy nanoscratching using a simple optical microscope setup. The measurement results are utilized to analyze the mode characteristics of atomic force microscopy nanoma-chining. Unlike typical atomic force microscopy force measurement methods using position-sensitive detector signal analysis, the optically measured atomic force microscopy cantilever deformation data using varying input (normal) forces along with information on the cantilever stiffness were used to estimate the components of the actual force exerted during nanomachining without using complex data interpolation methods. Scratching experiments were performed on Si(100) workpieces, and the estimated real force values were compared with the experimental data from atomic force microscopy nanomachining for each input force and corresponding scratch depth. Frictional coefficients and in-process acoustic emission monitoring results were also used to conduct an in-depth analysis of the actual force results. It is shown that the estimation results are meaningfully close to both the theoretical evaluations and the scratching experimental data as the scratch depth changes. Moreover, the force data are shown to have the ability to detect mode transitions such as the elastic-plastic and the plowing-cutting transitions during nanomachining, which validates the utility of this approach.
机译:原子力显微镜通常不仅用于获取亚纳米尺度的样品表面形貌,而且还用于测量成像过程中表面上的力。这项研究的目的是为使用简单的光学显微镜设置在原子力显微镜纳米刮擦过程中施加的实际刮擦力开发一种实用的测量方案。测量结果用于分析原子力显微镜纳米加工的模式特性。与使用位置敏感探测器信号分析的典型原子力显微镜力测量方法不同,使用变化的输入(法向)力以及悬臂刚度信息的光学测量原子力显微镜悬臂变形数据来估算施加的实际力的分量在纳米加工中无需使用复杂的数据插值方法。在Si(100)工件上进行了划痕实验,并将估计的真实力值与原子力显微镜纳米机械加工针对每个输入力和相应划痕深度的实验数据进行了比较。摩擦系数和过程中的声发射监测结果也用于对实际力结果进行深入分析。结果表明,随着划痕深度的变化,估计结果与理论评估和划痕实验数据都非常接近。此外,力数据显示具有检测模式转换的能力,例如纳米加工过程中的弹塑性和犁切转换,这验证了该方法的实用性。

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