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A comparative study of halogen & methanesulfonic acid electrotinning processes

机译:卤素与甲磺酸电镀锡工艺的比较研究

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摘要

The characteristics of a typical halogen and a patented methanesulfonic-acid-based electrotinning process were studied, using laboratory tests. The stability of the bath and its corrosiveness toward the steel substrate were evaluatedsimultaneously by a "spinning disc" experimental technique. The results show that the MSA bath is very stable, with a low oxidation rate of stannous ions, but is much more corrosive to the steel substrate. The effects of operating conditions, such as line speed and current density, on the plating efficiency, coating morphology and preferred crystal orientation were investigated, using a rotating cylinder cathode. Comparison of the plating efficiencies obtained from the rotating cylinder cathode andproduction identified a window of test conditions that is representative of production conditions. Within this window, the MSA process offers a higher plating efficiency at high current densities, but different microstructure and preferred crystalorientation compared with those of the halogen process. The coating morphology in the MSA bath also exhibits a greater variation at low current densities, resulting in a narrower operating window. In both processes, the grain size increases in thedirections parallel as well as normal to the steel substrate. This three-dimensional grain growth is accompanied by a continuing change in crystal orientation, suggesting that recrystallization takes place during these two electrotinning processes.
机译:使用实验室测试研究了典型卤素和基于甲磺酸的专利镀锡工艺的特性。通过“旋转盘”实验技术同时评估了镀液的稳定性及其对钢基材的腐蚀性。结果表明,MSA镀液非常稳定,亚锡离子的氧化率低,但对钢基材的腐蚀性更大。使用旋转圆柱阴极研究了诸如线速度和电流密度之类的操作条件对电镀效率,涂层形态和优选晶体取向的影响。从旋转圆柱体阴极和生产获得的电镀效率的比较确定了代表生产条件的测试条件窗口。在此窗口内,MSA工艺在高电流密度下可提供更高的电镀效率,但与卤素工艺相比,具有不同的微观结构和优选的结晶取向。 MSA镀液中的涂层形态在低电流密度下也表现出较大的变化,从而导致工作窗口变窄。在这两个过程中,晶粒尺寸都在平行于钢基板的方向以及垂直于钢基板的方向上增大。这种三维晶粒生长伴随着晶体取向的持续变化,这表明在这两个电镀过程中会发生重结晶。

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