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CHROMIUM - COPPER SYSTEM: ADHESION CHARACTERISTICS, DOPING, THE STRUCTURE OF PHASE BOUNDARY AND COMPOSITES

机译:铬铜系统:粘附特性,掺杂,相边界和复合材料的结构

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摘要

The adhesive characteristics and the formation of phase boundaries in the Cr - Cu system in a vacuum of (2-4) centre dot 10~(-3) Pa in the temperature range 1100-1300 deg C have been studied. The microstructure of composites (50:50 by mass) made by copper impregnation of porous samples of Cr electrolytic powder and Cr obtained by calcium hydride reduction. The effect of Cr, Fe, Co, Ni, Si additions on above characteristics has been investigated.
机译:研究了在1100〜1300℃的温度范围内(2-4)中心点10〜(-3)Pa的真空条件下Cr-Cu体系的黏着特性和相界的形成。通过对多孔的Cr电解粉和氢化钙还原得到的Cr样品进行铜浸渍制成的复合材料(质量比为50:50)的微观结构。研究了Cr,Fe,Co,Ni,Si添加量对上述特性的影响。

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