Effects of SiC{sub}p reinforcement by electroless copper plating on properties o Cu/SiC{sub}p composites

摘要

Silicon carbide reinforced copper matrix composites containing 50-80 vol.-%SiC{sub}p were fabricated by hot pressing copper coated SiC{sub}p powder. The results show that the densification, thermal expansion coefficients, flexural strength, andthermal conductivity of Cu/SiC{sub}p composites reinforced by electroless copper plating and their corrosion resistance in 5%NaCI solution are better than those without electroless plating. Physical properties and flexural strength of the compositesdecrease with an increase in SiC{sub}p content, whereas the corrosion resistance increases with an increase in SiC{sub}p volume fraction. By observing the fracture surface after a flexural test, it can be seen there are two types of fracture model: thecracking of Cu/SiC{sub}p interface and the pulling out of SiC{sub}p particles. The experiment also proved that the bonding strength of the Cu/SiC{sub}p interface and the pressure of the hot pressing operation are the two main factors which influence thefracture of these composites.