Effects of Film and Substrate Dimensions on Warpage of Film Insert Molded Parts

摘要

Three-dimensional flow and structural analyses were carried out for film insert injection molding to investigate warpage of film insert molded (FIM) parts with respect to variation of film and substrate thickness. Asymmetry of temperature distribution in the thickness direction was increased with increasing film thickness but decreased with increasing substrate thickness. Asymmetry of the in-mold residual stress distribution in the FIM specimen was generated by the nonuniform temperature distribution, and it was increased with increasing film thickness but reduced with increasing substrate thickness. Warpage of the ejected FIM specimen was determined by relaxation of the asymmetric in-mold residual stress distribution, and it was increased with increasing film thickness but reduced with increasing substrate thickness. Warpage of FIM specimens annealed at 80 C for 30 min showed complex behavior, and the behavior was understood by using factors such as degree of warpage of the ejected part, thermal shrinkage of the inserted film, and retardation of heat transfer.