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Interpenetrating polymer networks based on modified cyanate ester resin

机译:基于改性氰酸酯树脂的互穿聚合物网络

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Cyanate esters with inherently low relative permittivity and loss are well known as good resin materials used in the electronics industry However very high temperatures (>3000C) are usually required for crosslinking by cyclotrimerisation of cyanate ester groups in uncatalysed systems. It has been reported that phenolic hydroxy groups could have a catalytic effect on cyclotrimerisation of cyanate esters. In this study, 2,2'-diallylhisphenol A (DBA), with two phenolic hydroxy groups, has been used as a catalyst tot the crosslinking of a cyanate ester (b10). The double bonds on DBA can readily copolymerise with added bismaleimide to form interpenetrating polymer networks (IPN). High performance IPNs based on different ratios of cyanate ester (b10) and DBA with added bismaleimide have been synthesised. In these self-catalytic IPN resin systems, cyanate ester and DBA/bismaleimide are believed to crosslink via different reactions to form two interpenetrating polymer networks in the cured resin structure. Such a unique combination thus enables cyanate esters to be cured at a lower temperature while largely maintaining their superior dielectric properties. The catalytic effect of hydroxy phenolic groups and the reactivity of new CE-DBA/bismaleimide IPN resin systems were investigated by differential scanning calorimetry. The glass transition temperature and mechanical properties were evaluated by dynamic mechanical analysis and flexural and impact testing. The dielectric properties of the cured resins are also discussed. The IPN resin systems obtained have potential applications in the aerospace and microelectronics industries.
机译:具有固有低的相对介电常数和损耗的氰酸酯是众所周知的电子工业中使用的良好树脂材料。然而,在未催化体系中,通常需要很高的温度(> 3000C)才能通过氰酸酯基团的环三聚进行交联。据报道,酚羟基可对氰酸酯的环三聚反应具有催化作用。在这项研究中,具有两个酚羟基的2,2'-二烯丙基苯酚A(DBA)已用作催化剂来氰酸酯(b10)的交联。 DBA上的双键可以很容易地与添加的双马来酰亚胺共聚形成互穿聚合物网络(IPN)。合成了基于不同比例的氰酸酯(b10)和DBA并添加双马来酰亚胺的高性能IPN。在这些自催化IPN树脂体系中,据信氰酸酯和DBA /双马来酰亚胺通过不同的反应交联,从而在固化的树脂结构中形成两个互穿的聚合物网络。因此,这种独特的组合能够使氰酸酯在较低的温度下固化,同时很大程度上保持其优异的介电性能。用差示扫描量热法研究了羟基酚基的催化作用和新型CE-DBA /双马来酰亚胺IPN树脂体系的反应性。通过动态力学分析以及弯曲和冲击测试来评估玻璃化转变温度和机械性能。还讨论了固化树脂的介电性能。获得的IPN树脂系统在航空航天和微电子工业中具有潜在的应用。

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